DLM Handicard Solder (Resin Cored) 50/50 2.3mm Gauge 25gms - HC50
POA
Model: HC50
DLM Handicard Solder (Resin Cored) 50/50 2.3mm Gauge 25gms - HC50
- Grade % Tin/Lead: 50/50
- Gauge: 2.3mm
- Nett Weight: 25gms
Dlm Solder is made from Pure Virgin Metals. Produced to BS219 1977.
Pre-fluxed - Five Flux Core. For Use with Copper Brass Tin.
60/40 Grade is ideal for most electrical work.
96.5% Tin 3.5% Silver EUTECTIC
95% Tin 5% Antimony Electrical equipment, high conductivity + MP*
99.3% Tin 0.7% Copper Hard tin - resists foodstuffs, drugs, artist colours
Available in resin core and solid wire
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